Algorithms for Coupled Transient Simulation of Circuits and Complicated 3-D Packaging
نویسندگان
چکیده
In this paper techniques are described for coupled simulation of complicated 3-D interconnect and non-linear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect ; a sectioning method for tting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in spice3. Results are presented to demonstrate some of the frequency-dependent eeects in a packaging analysis problem.
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